Used primarily as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising thermal or chemical resistance. Its polyether backbone provides hydrophilic character, making it suitable for coatings, adhesives, and sealants requiring moisture resistance and low shrinkage upon curing. Commonly employed in specialty formulations for electronics encapsulation, where improved dielectric properties and reduced internal stress are critical. Also utilized in synthesizing block copolymers for advanced materials and in lithography for photoresists due to its ability to form stable, fine-patterned structures.