Used as a reactive diluent and modifier in epoxy resin systems to reduce viscosity without sacrificing thermal or mechanical properties. Enhances workability in coatings, adhesives, and encapsulants. Improves flexibility and impact resistance in cured epoxy formulations. Commonly applied in electronic potting compounds, industrial flooring, and composite materials where lower viscosity and good chemical resistance are required. Also used in primers and corrosion-resistant linings due to its adhesion and durability.