Used as a reactive diluent and crosslinking agent in epoxy resin systems, enhancing mechanical strength and thermal stability of composites. Commonly applied in high-performance coatings, adhesives, and encapsulants where low viscosity and improved durability are required. Suitable for UV-curable formulations due to its ability to participate in cationic polymerization. Also employed in hybrid organic-inorganic materials for optical and electronic applications owing to its well-defined structure and compatibility with sol-gel processes.