Used primarily as a reactive diluent in epoxy resin systems, this chemical helps reduce viscosity without significantly compromising the mechanical or thermal properties of the final cured product. It is commonly applied in coatings, adhesives, sealants, and composite materials where improved flow and wetting are required during processing. Its glycidyl end-capping allows it to participate in the curing reaction, enhancing crosslink density and contributing to good chemical and heat resistance in the cured matrix. It is especially valued in electrical encapsulation and structural bonding applications due to its reliability and performance under stress.