Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flow and workability in coatings, adhesives, and encapsulants. Improves flexibility and impact resistance of cured epoxy formulations. Commonly employed in high-performance composites, electrical insulation, and industrial flooring due to its ability to participate in the curing reaction and contribute to the final polymer network. Also utilized in UV-curable coatings and inks for fast curing and improved durability.