Used primarily as a high-performance epoxy resin modifier, this compound enhances thermal stability and mechanical strength in composite materials. It is especially effective in aerospace and electronics applications where resistance to high temperatures and dimensional stability are critical. Its rigid molecular structure contributes to improved glass transition temperatures (Tg) in cured epoxy systems, making it suitable for advanced printed circuit boards and structural adhesives. Additionally, it is employed in specialty coatings that require exceptional durability and chemical resistance.