Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flow and workability in coatings, adhesives, and sealants. Improves flexibility and impact resistance of cured epoxy formulations. Commonly applied in composite materials, electrical encapsulation, and flooring systems. Also utilized in modifying resins for 3D printing and specialty polymers due to its ability to participate in crosslinking reactions.