Used primarily as a reactive diluent and modifier in epoxy resin systems, enhancing flexibility and adhesion in coatings, adhesives, and composite materials. Its vinyl and epoxide functionalities allow for copolymerization in radiation-curable formulations, making it suitable for UV-cured inks, electronics encapsulation, and specialty polymers. The compound improves processability without significantly reducing glass transition temperature, beneficial in high-performance industrial applications.