Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances the flow and workability of epoxy formulations, making them easier to process in coatings, adhesives, and composite materials. Improves flexibility and impact resistance of cured epoxy networks. Commonly employed in high-performance industrial coatings, electrical encapsulation, and aerospace applications where durability and chemical resistance are critical. Also used in UV-curable formulations due to its ability to participate in radical and cationic curing mechanisms.