Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flow and workability in coatings, adhesives, and composite formulations. Commonly applied in electronics encapsulation, aerospace composites, and high-performance paints due to its ability to improve cross-linking density and thermal stability. Also utilized in 3D printing resins where low viscosity and high reactivity are required. Its multi-epoxide structure enables the formation of tightly cross-linked networks, resulting in durable, chemically resistant end products.