Used as a curing agent and crosslinking promoter in epoxy resin systems, enhancing thermal stability and mechanical strength in coatings, adhesives, and electrical encapsulants. Commonly applied in the electronics industry for molding compounds and semiconductor packaging due to its excellent moisture resistance and low ionic impurity content. Also functions as a heat stabilizer in plastics, particularly in polyvinyl chloride (PVC) and engineering thermoplastics, improving processability and long-term performance under elevated temperatures. Its mixed amine structure offers balanced reactivity, making it suitable for use in powder coatings and composite materials where controlled cure profiles are essential.