Used as a reactive diluent and curing agent modifier in epoxy resin systems, enhancing flexibility and adhesion in coatings and adhesives. Its epoxy-functional structure allows it to participate in the crosslinking reaction, improving the toughness and impact resistance of the final cured product. Commonly applied in high-performance industrial coatings, electronic encapsulants, and composite materials where thermal stability and mechanical strength are critical. Also utilized in UV-curable formulations when combined with cationic photoinitiators, enabling dual-cure mechanisms for complex manufacturing processes.