Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flexibility and impact resistance in coatings, adhesives, and encapsulants. Commonly employed in electronics for potting compounds due to its low volatility and good electrical insulation properties. Also utilized in composite formulations where improved flow and wetting are required. Suitable for low-temperature curing applications owing to its high reactivity with various hardeners.