Used as a reactive diluent and modifier in epoxy resin systems, improving flexibility and reducing viscosity without compromising thermal and mechanical properties. Commonly applied in high-performance coatings, adhesives, and composite materials where enhanced toughness and adhesion are required. Its epoxide-functional structure enables co-reaction with curing agents, contributing to a densely crosslinked network. Also utilized in electronics encapsulation and structural bonding due to its low volatility and good chemical resistance.