Used as a reactive diluent and crosslinking agent in epoxy resin systems to improve mechanical strength, heat resistance, and chemical resistance. Enhances the performance of coatings, adhesives, and composite materials by increasing crosslink density. Commonly applied in high-performance industrial coatings, electrical encapsulation, and aerospace composites where thermal and chemical stability are critical. Also functions as a modifier in thermosetting polymers to reduce viscosity without sacrificing reactivity, enabling easier processing and improved cure characteristics.