Used as a reactive diluent and crosslinking agent in high-performance epoxy resin systems. Provides improved thermal stability and mechanical strength to composites. Commonly applied in advanced electronics encapsulation, aerospace materials, and high-temperature adhesives due to its ability to form dense, rigid networks upon curing. Also utilized in lithography and microelectronics as a component in photoresist formulations. Shows good compatibility with various hardeners and enhances glass transition temperature (Tg) of cured resins.