Used as a reactive diluent and flexibilizer in epoxy resin systems, improving flow and reducing viscosity without compromising mechanical strength. Enhances adhesion and impact resistance in coatings, adhesives, and composites. Commonly applied in electronics encapsulation, aerospace materials, and high-performance industrial coatings due to its ability to modify glass transition temperature and reduce internal stress in cured resins. Also utilized in 3D printing formulations where controlled curing and flexibility are required.