Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Enhances flexibility and impact resistance of cured epoxy formulations. Commonly applied in coatings, adhesives, and electronic encapsulants where improved flow and adhesion are required. Its difunctional structure supports cross-linking, contributing to chemical and heat resistance in the final product. Also utilized in UV-curable systems and composite materials for better resin wetting and fiber bonding.