Used primarily as a reactive diluent in epoxy resin systems, this compound helps reduce viscosity without sacrificing performance, enabling easier processing and improved wetting of substrates in coatings, adhesives, and composites. Its ability to participate in the curing reaction enhances crosslinking density, leading to better mechanical properties and chemical resistance in the final product. Commonly applied in high-performance industrial coatings, electrical encapsulation, and aerospace composites where durability and thermal stability are critical.