HyPer N10 is widely used as a high-performance curing agent in epoxy resin systems. It enables fast curing at room temperature and delivers excellent mechanical strength and chemical resistance in the final product. Commonly applied in composite materials for aerospace, automotive, and wind energy sectors, it ensures reliable bonding in structural adhesives and high-durability coatings. Its low viscosity facilitates easy processing and deep penetration in fiber-reinforced laminates, making it ideal for vacuum infusion and filament winding processes. Additionally, it is favored in electrical encapsulation due to its stable electrical insulation properties and resistance to moisture.