Used as a key intermediate in the synthesis of high-performance epoxy resins, particularly in aerospace and electronic applications due to its ability to form thermally stable and mechanically strong networks. Its molecular structure supports enhanced cross-linking, improving the resin’s resistance to heat and chemical degradation. Commonly found in composite materials for aircraft components and in encapsulants for microelectronics where reliability under extreme conditions is critical. Also utilized in specialty coatings requiring long-term durability and adhesion.