Used as a reactive diluent and modifier in epoxy resin systems to reduce viscosity while maintaining high thermal and chemical resistance. Enhances the mechanical properties and durability of coatings, adhesives, and composite materials. Commonly employed in electronic encapsulants and printed circuit board laminates due to its excellent electrical insulation and low moisture absorption. Its rigid cyclic structure contributes to high glass transition temperatures in cured resins, making it suitable for high-performance applications in aerospace and electronics.