Used in advanced polymer synthesis, particularly in the development of high-performance epoxy resins. Its unique bridged bicyclic structure contributes to enhanced thermal stability and mechanical strength in cured resin systems. Commonly applied in aerospace composites, electronic encapsulants, and specialty coatings where resistance to heat and chemical degradation is critical. Also investigated as a crosslinking agent in high-temperature adhesives due to its ability to form dense, rigid networks. Limited solubility in common solvents makes it suitable for formulations requiring low volatility and high reactivity under controlled curing conditions.