Used as a reactive diluent in epoxy resin systems to reduce viscosity without sacrificing performance. Improves workability and flow properties in coatings, adhesives, and encapsulants. Enhances flexibility and impact resistance of cured epoxy formulations. Commonly applied in electronic potting compounds, industrial coatings, and composite materials where low volatility and good chemical resistance are required. Also utilized in formulations needing improved wetting of substrates and fillers.