Used primarily as an accelerator in epoxy resin systems, especially in adhesives, coatings, and casting compounds. It promotes faster curing at room temperature or elevated temperatures, improving the efficiency of the curing process. Commonly found in industrial and construction adhesives where strong, durable bonds are required. Also utilized in formulations requiring good flexibility and resistance to thermal and mechanical stress. Its reactivity makes it suitable for applications needing short processing times and high performance in final product strength.