Used primarily as a reactive diluent and modifier in epoxy resin systems, enhancing flexibility and reducing viscosity without compromising chemical resistance. Commonly applied in high-performance coatings, adhesives, and composite materials where improved toughness and thermal stability are required. Its rigid molecular structure contributes to superior mechanical strength in cured epoxies, making it suitable for aerospace, electronics encapsulation, and structural adhesives. Also utilized in specialty polymers and crosslinking agents for advanced material formulations.