Used primarily as a reactive diluent in epoxy resin formulations, enhancing flexibility and reducing viscosity for easier application. It improves the mechanical properties of coatings, adhesives, and composites, making them more durable and resistant to environmental factors. Additionally, it finds use in the electronics industry for encapsulating and protecting sensitive components due to its excellent adhesion and insulation properties. Its compatibility with various curing agents allows for tailored performance in specific industrial applications.