Used in gold plating processes, especially in electronics and semiconductor industries, where a thin, conductive gold layer is required for corrosion resistance and electrical conductivity. It serves as a precursor for depositing gold films through electroless plating or electroplating methods. Also utilized in the synthesis of gold nanoparticles for applications in catalysis, sensors, and medical diagnostics due to its ability to provide controlled reduction to metallic gold. Plays a role in research and development of gold-based catalysts and conductive inks.