Y solution
100µg/ml,5% HNO3
Reagent
Code: #199353
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Storage & Handling
Storage
2~8°C
description Product Description
Used in electroplating processes to deposit thin, uniform layers of metal onto surfaces, enhancing corrosion resistance and improving aesthetic finish. Commonly applied in electronics manufacturing for coating connectors and components to ensure reliable conductivity. Also utilized in the production of decorative finishes for automotive and plumbing fixtures due to its consistent plating quality. Suitable for use with various base metals, including steel and copper alloys.
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