B solution is commonly used in electroplating processes, particularly in the deposition of nickel and cobalt alloys. It serves as a key component in bath formulations due to its ability to stabilize metal ions and improve the uniformity and adhesion of the plated layer. The solution is also utilized in analytical chemistry for pH control and as a buffering agent in metal finishing operations. Its consistent performance in maintaining bath chemistry makes it valuable in industrial surface treatment applications where precision and durability are required. Additionally, B solution supports efficient conductivity in plating baths, reducing energy consumption and enhancing deposition rates.