Used as a high-performance crosslinking agent in advanced polymer systems, particularly in aerospace and electronics. Enhances thermal stability and mechanical strength of resins when cured. Commonly applied in composite materials requiring resistance to extreme temperatures and radiation. Also utilized in optoelectronic applications due to its rigid, conjugated structure that supports efficient light emission and charge transport. Suitable for use in coatings, adhesives, and encapsulants where durability and performance under stress are critical.