Used as a highly effective crosslinking agent in advanced polymer systems, particularly in high-performance coatings and adhesives. Its unique multi-functional structure enables superior network formation, enhancing thermal stability, chemical resistance, and mechanical strength of cured resins. Commonly applied in specialty epoxy formulations where low viscosity and extended working time are required without sacrificing final material toughness. Also utilized in electronic encapsulants and underfill materials due to its reliable curing behavior and low ionic impurity content.