Widely used in UV-curable formulations due to its high reactivity and ability to form crosslinked networks upon exposure to ultraviolet light. Commonly found in coatings, inks, and adhesives where fast curing, hardness, and chemical resistance are required. Its trifunctional structure enhances crosslinking density, improving mechanical strength and durability of the final product. Also used in 3D printing resins to achieve high resolution and structural integrity. Offers good adhesion to various substrates and contributes to low shrinkage during curing. Suitable for industrial and electronic applications where performance under stress and environmental exposure is critical.