Used primarily as a crosslinking agent in polymer formulations, this compound enhances thermal and mechanical stability of resins. It is especially effective in improving hardness and chemical resistance in coatings and adhesives. Commonly employed in high-performance composites and electronic encapsulants due to its rigid polycyclic structure, it contributes to low shrinkage during curing and supports dimensional stability. Also utilized in specialty acrylic monomers for UV-curable systems, offering rapid curing with minimal volatile emissions.