Used primarily as a crosslinking agent in polymer chemistry, this compound enhances the thermal and mechanical stability of resins and coatings. It is especially effective in improving the performance of thermosetting materials used in electronics, such as encapsulants and printed circuit boards. Its structure supports efficient radical curing processes, making it valuable in UV-curable systems and adhesives. Additionally, it is employed in the synthesis of specialty polyesters and engineering plastics where high durability and resistance to environmental stress are required.