N,N-Bis[2-(p-tolylsulfonyloxy)ethyl]-p-toluenesulfonamide

97%

Reagent Code: #217154
fingerprint
CAS Number 16695-22-0

science Other reagents with same CAS 16695-22-0

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 567.69 g/mol
Formula C₂₅H₂₉NO₈S₃
badge Registry Numbers
MDL Number MFCD00026000
thermostat Physical Properties
Melting Point 92-98 °C(Lit.)
inventory_2 Storage & Handling
Storage Room temperature, seal, dry

description Product Description

Used as a crosslinking agent in polymer chemistry, particularly in the production of high-performance resins and thermosetting materials. It enables the formation of stable three-dimensional networks by reacting with nucleophilic groups in polymers, enhancing thermal stability, mechanical strength, and chemical resistance. Commonly applied in coatings, adhesives, and electronic encapsulants where durability under harsh conditions is required. Also utilized in specialty curing systems for epoxy and unsaturated polyester formulations, offering controlled reactivity and improved processing characteristics.

shopping_cart Available Sizes & Pricing

Size Availability Unit Price Quantity
inventory 25g
10-20 days ฿710.00
inventory 100g
10-20 days ฿2,690.00

Cart

No products

Subtotal: 0.00
Total 0.00 THB
N,N-Bis[2-(p-tolylsulfonyloxy)ethyl]-p-toluenesulfonamide
No image available

Used as a crosslinking agent in polymer chemistry, particularly in the production of high-performance resins and thermosetting materials. It enables the formation of stable three-dimensional networks by reacting with nucleophilic groups in polymers, enhancing thermal stability, mechanical strength, and chemical resistance. Commonly applied in coatings, adhesives, and electronic encapsulants where durability under harsh conditions is required. Also utilized in specialty curing systems for epoxy and unsatu

Used as a crosslinking agent in polymer chemistry, particularly in the production of high-performance resins and thermosetting materials. It enables the formation of stable three-dimensional networks by reacting with nucleophilic groups in polymers, enhancing thermal stability, mechanical strength, and chemical resistance. Commonly applied in coatings, adhesives, and electronic encapsulants where durability under harsh conditions is required. Also utilized in specialty curing systems for epoxy and unsaturated polyester formulations, offering controlled reactivity and improved processing characteristics.

Mechanism -
Appearance -
Longevity -
Strength -
Storage -
Shelf Life -
Allergen(s) -
Dosage (Range) -
Dosage (Per Day) -
Mix Method -
Heat Resistance -
Stable in pH range -
Solubility -
Product Types -
INCI -

Purchase History for

Loading purchase history...