3,3'-disulfanediylbis(N-(2-(2-((6-chlorohexyl)oxy)ethoxy)ethyl)propanamide)

95%

Reagent Code: #216182

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 621.71 g/mol
Formula C₂₆H₅₀O₆Cl₂N₂S₂
inventory_2 Storage & Handling
Storage Room temperature, seal, dry

description Product Description

Used as a crosslinking agent in specialty polymers, particularly in the development of heat-resistant and chemically stable coatings. Its structure allows for the formation of disulfide bridges, enhancing mechanical strength and thermal stability of polymeric materials. Applied in advanced adhesives and sealants where durability under harsh conditions is required. Also investigated for use in controlled drug delivery systems due to its responsive disulfide bonds that can break under reducing environments. Suitable for surface modification of functional materials in electronic and biomedical applications.

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Size Availability Unit Price Quantity
inventory 500mg
10-20 days ฿36,100.00

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3,3'-disulfanediylbis(N-(2-(2-((6-chlorohexyl)oxy)ethoxy)ethyl)propanamide)
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Used as a crosslinking agent in specialty polymers, particularly in the development of heat-resistant and chemically stable coatings. Its structure allows for the formation of disulfide bridges, enhancing mechanical strength and thermal stability of polymeric materials. Applied in advanced adhesives and sealants where durability under harsh conditions is required. Also investigated for use in controlled drug delivery systems due to its responsive disulfide bonds that can break under reducing environments

Used as a crosslinking agent in specialty polymers, particularly in the development of heat-resistant and chemically stable coatings. Its structure allows for the formation of disulfide bridges, enhancing mechanical strength and thermal stability of polymeric materials. Applied in advanced adhesives and sealants where durability under harsh conditions is required. Also investigated for use in controlled drug delivery systems due to its responsive disulfide bonds that can break under reducing environments. Suitable for surface modification of functional materials in electronic and biomedical applications.

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