N,N'-(Ethane-1,2-diyl)bis(3-methylbenzenesulfonamide)
98%
science Other reagents with same CAS 793713-92-5
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description Product Description
Used as a curing agent in epoxy resin systems, enhancing thermal and mechanical properties. Provides improved heat resistance and chemical stability in coatings, adhesives, and electrical encapsulants. Suitable for applications requiring long working time and high-performance end products, such as in aerospace, electronics, and composite materials. Also functions as a crosslinking agent in specialty polymers.
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