Used as a curing agent and crosslinking agent in epoxy resin systems, providing enhanced thermal stability and mechanical strength to the cured resins. It is particularly effective in high-performance composite materials, electrical insulation, and aerospace applications due to its ability to form dense, heat-resistant polymer networks. Also employed in specialty adhesives and coatings where durability under extreme conditions is required. Its low volatility and good solubility in common solvents facilitate processing in industrial formulations.