Used primarily as a crosslinking agent in high-performance polymers, this compound enhances thermal stability and mechanical strength in epoxy resins and polyimides. It is especially effective in applications requiring resistance to extreme heat and harsh chemicals, such as in aerospace composites, electronic encapsulants, and insulating materials for microelectronics. Its rigid molecular structure contributes to improved glass transition temperatures in cured resin systems. Additionally, it serves in specialty coatings where durability and adhesion under stress are critical.