Used as a crosslinking agent in polymer chemistry, particularly in the development of epoxy resins and polyurethanes, enhancing thermal stability and mechanical strength. It serves as a curing agent in composite materials for aerospace and electronics due to its ability to form dense, heat-resistant networks. Also employed in specialty adhesives and coatings where high performance under elevated temperatures is required. Its structure allows for controlled reactivity, making it suitable in formulations requiring extended pot life and deep-section curing.