Used primarily as a reactive diluent and crosslinking agent in cationic UV-curing formulations. It helps reduce viscosity in epoxy resin systems without compromising cure speed or final material properties. Commonly applied in radiation-curable coatings, inks, and adhesives where low shrinkage, high clarity, and excellent chemical resistance are required. Its alicyclic epoxy structure provides good thermal stability and weatherability, making it suitable for outdoor coatings and high-performance industrial finishes. Also utilized in composite materials and electronic encapsulants due to its low volatility and high reactivity under UV light in the presence of photoacid generators.