Used as a high-performance curing agent in epoxy resins, particularly in aerospace and electronics industries due to its ability to form thermally stable and mechanically strong networks. Exhibits excellent reactivity at elevated temperatures, enabling fast curing with minimal byproducts. Its fluorinated structure enhances moisture resistance and dielectric properties, making it suitable for encapsulation and insulation materials in harsh environments. Also investigated as a precursor in specialty polymers requiring chemical and thermal stability.