Used as a key intermediate in the synthesis of high-performance polymers, particularly in the development of specialty polyamides and polyimides that exhibit excellent thermal stability and mechanical strength. Commonly applied in advanced coating materials and electronic encapsulants due to its ability to enhance adhesion and resistance to thermal degradation. Also utilized in the formulation of curable resins for aerospace and microelectronics industries where reliability under extreme conditions is critical. Its flexible ether linkages and hydrazide functionality enable crosslinking at moderate temperatures, making it suitable for heat-sensitive applications. Additionally, explored in controlled release systems and functional gels due to its hydrogen bonding capacity and solubility characteristics.