Used as a specialty curing agent in high-performance epoxy resin systems, particularly in aerospace and electronic applications. Its unique bridged bicyclic structure provides enhanced thermal stability and mechanical strength to cured polymers. Commonly employed in composites requiring low dielectric constants and high glass transition temperatures. Also utilized in encapsulation materials for microelectronics due to its low moisture absorption and excellent electrical insulation properties. Shows good compatibility with aromatic and cycloaliphatic epoxy resins, enabling formulations with extended pot life and controlled reactivity.