Used primarily as a curing agent for epoxy resins, enabling the formation of thermoset polymers with good electrical insulation and mechanical strength. Commonly applied in the electronics industry for encapsulating components, insulating motors, and in coil windings due to its low viscosity and high reactivity. Also utilized in composite materials and adhesives where moderate heat resistance and durability are required. Suitable for casting and molding processes because of its ability to form stable, cross-linked networks with minimal byproducts.