Used primarily in the formulation of high-performance polyimides and epoxy resins due to its multi-functional amine structure. Its rigid, star-shaped molecular architecture enhances thermal stability and mechanical strength in cured polymers, making it suitable for aerospace, microelectronics, and advanced composite materials. Commonly employed as a crosslinking agent in high-temperature adhesives and encapsulants. Also explored in optoelectronic applications, including organic light-emitting diodes (OLEDs), where its charge-transport properties improve device efficiency. Its bulky structure helps reduce molecular aggregation, supporting better film formation in thin-film coatings.