Used as a curing agent for high-performance epoxy resins, enabling the production of materials with excellent thermal stability and mechanical strength. Commonly applied in aerospace, electronics, and advanced composite industries where durable, heat-resistant bonding is required. Its rigid cyclobutane backbone contributes to enhanced glass transition temperatures in cured polymers, making it suitable for high-temperature applications such as printed circuit boards and structural adhesives. Also investigated as a building block in specialty polyamides and polyureas for advanced coating systems.