4,4'-Oxybis[(methoxymethyl)benzene]

≥97%

Reagent Code: #118365
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CAS Number 2509-26-4

science Other reagents with same CAS 2509-26-4

blur_circular Chemical Specifications

scatter_plot Molecular Information
Weight 258.32 g/mol
Formula C₁₆H₁₈O₃
badge Registry Numbers
MDL Number MFCD00082840
thermostat Physical Properties
Boiling Point 161°C/2mmHg(lit.)
inventory_2 Storage & Handling
Storage room temperature, dry

description Product Description

Used primarily as a reactive diluent in epoxy resin formulations, it helps reduce viscosity, improving processing and application. It enhances the flexibility and adhesion of coatings, making it suitable for use in paints, varnishes, and adhesives. Additionally, it acts as a crosslinking agent in polymer systems, contributing to the durability and chemical resistance of final products. Its application extends to the electronics industry, where it is used in encapsulants and potting compounds to protect sensitive components.

format_list_bulleted Product Specification

Test Parameter Specification
Appearance Colorless to light yellow to light orange clear liquid
Purity (%) 96.5-100%
Infrared Spectrum Conforms to Structure
NMR Conforms To Structure

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Size Availability Unit Price Quantity
inventory 5g
10-20 days ฿2,490.00

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4,4'-Oxybis[(methoxymethyl)benzene]
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Used primarily as a reactive diluent in epoxy resin formulations, it helps reduce viscosity, improving processing and application. It enhances the flexibility and adhesion of coatings, making it suitable for use in paints, varnishes, and adhesives. Additionally, it acts as a crosslinking agent in polymer systems, contributing to the durability and chemical resistance of final products. Its application extends to the electronics industry, where it is used in encapsulants and potting compounds to protect s

Used primarily as a reactive diluent in epoxy resin formulations, it helps reduce viscosity, improving processing and application. It enhances the flexibility and adhesion of coatings, making it suitable for use in paints, varnishes, and adhesives. Additionally, it acts as a crosslinking agent in polymer systems, contributing to the durability and chemical resistance of final products. Its application extends to the electronics industry, where it is used in encapsulants and potting compounds to protect sensitive components.

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