Cu solution
10000µg/ml,2.0 mol/L HNO3
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description Product Description
Used as a precursor in the synthesis of copper-based nanomaterials for electronics and catalysis. Applied in electroplating processes to deposit thin copper films on surfaces for printed circuit boards and semiconductors. Employed in agricultural formulations as a micronutrient supplement in fertilizers to correct copper deficiency in soils, and as a component in fungicides to control plant diseases. Utilized in antimicrobial coatings and textiles due to copper’s biocidal properties. Serves in laboratory settings for preparing standard solutions in analytical chemistry, for calibration of instruments, and in specific tests such as Fehling's reaction for reducing sugars. Also used in the production of pigments, dyes, and in wastewater treatment to remove sulfides.
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